Analytical services
Mixtures, phases, structures
|
Analytical
technique |
Application
areas |
Detection
limits/ resolving power |
Depth
resolution |
Sample size/
Lateral resolution |
|
X-ray diffraction |
Identification and
quantification of crystalline compounds and phases |
|
- |
100 mg |
|
Infrared
spectroscopy |
Identification and
analysis of polymers and organic compounds |
400-4000 cm-1
0.1% |
- |
- |
|
Ultraviolet/visible spectrometry |
Optical properties
of films and liquids |
200-800 nm |
- |
- |
High pressure
liquid chromatography |
Liquid organic
mixtures analysis |
- |
- |
- |
|
Gas
chromatography |
Static and dynamic
surface, pyrolysis, gas analysis |
- |
- |
- |
Chemical
composition
|
Analytical
technique |
Typical
applications |
Elements
detected |
Detection
limits/ resolving power |
Depth
resolution |
Sample size/
Lateral resolution |
|
X-ray fluorescent
spectrometry |
Qualitative and
quantitative elemental analysis of solids and liquids |
From Na to U |
0.001% |
- |
0.1 g |
|
Atomic absorption
spectrometry |
Analysis of chemical
composition |
70 elements |
0.00001% |
- |
0.1 mg |
|
Quadrupole mass
spectrometry |
Analysis of chemical
composition of gases |
From He to Pt |
10-10 Pa
(minimum detectable partial pressure) |
- |
- |
|
X-ray
photoelectron spectroscopy /
Electron
spectroscopy for chemical analysis |
Surface analysis of
inorganic and organic materials, depth profiling |
Li-U |
0.1-1 at %
submonolayer |
1-10 nm |
2 mm |
|
Ion selective
potentiometry |
Detection of ions in
liquids |
About 15 |
0.01% |
- |
1 ml |
|
Optical emission
spectrometry |
Semiquantitative
analysis of metals |
From Ti to U |
0.01% |
- |
1-2 g |
Electrical
characteristics of devices, junctions and materials
|
Analytical
technique |
Application
areas |
Range |
Resolving power |
I-V
Current-voltage
measurement device |
Measurements of
current-voltage characteristics of micro and optoelectronic devices and
junctions |
±1000
V
±2
A |
- |
C-V
Capacitance-voltage measurement device |
Measurements of
capacitance-voltage characteristics of micro and optoelectronic devices
and junctions |
±(0.001-100
pF)
±30
V |
- |
|
|
Testing of microwave
devices; transmittance of materials in microwave range |
12 - 78 GHz |
|
| |
|
|
|
Other
properties
|
Analytical
technique |
Application
areas |
Detection
limits/ resolving power |
Depth
resolution |
Sample size/
Lateral resolution |
ED
Electron
diffraction |
Identification and
quantification of crystalline compounds and phases of thin films |
- |
- |
|
|
Scanning electron
microscopy |
Surface morphology
and structure |
- |
- |
15 nm |
Brunauer-Emmet-Teller
surface analysis |
Measurement of
surface of powder materials by liquid nitrogen adsorption method |
- |
- |
- |
|
Laser
ellipsometry
Abbe
refractometry |
Measurement of
thickness and refractive index of thin layers |
0.5 nm
0.1 |
- |
30
mm |
|
Optical
microscopy and image processing |
Reflection,
transmission, polarized, and phase contrast microscopy |
x2000 |
- |
- |
Differential thermal analysis/
Thermogravimetry
|
Temperatures and
heat flow associated with transitions as function of temperature and
time weight loss, crystallinity, purity, stability and glass transitions |
20-1450 ºC |
- |
20-500 mg |
|
Atomic Force microscopy
|
Atomic Force Microscope (AFM) is used for investigation of the surfaces of various materials
|
- |
vertical: 0,1 - 0,2 nm; lateral: 2 nm
|
-
|
|
Quadrupole
Mass Spectrometer QUADRUVAC Q-200
It is a stationary gas analyzer with its own vacuum system, control and
programmator of the masses. QUADRUVAC Q-200 operates on the principle of
mass separation in high-frequency quadrupole field: the ion beam produced by
electron collision in the ion source is accelerated and injected into the
quadrupole separation system; by applying definitive separating voltage only
the ions having definitive mass/energy ratio pass separation system.
Pressure of the analyzed gas can range from atmospheric to 10-10 Pa. Range
of the masses under analysis 1-200 atomic units, resolving power - 15 %.
This device enables qualitative analysis and measurement of the total and
partial pressure of the vacuum system during different technological
process. Possible application areas include gas analysis and technological
process quality control in research and industry. |
|
Atomic Absorption Spectrometer Perkins Elmer Model 403
It is a simple double-beam spectrometer employing flame techniques. About 70
elements may be detected. Atomic absorption is a fast, simple analytical
method that is especially useful when a small number of elements have to be
determined in a large number of samples with moderate accuracy. This
quantitative analytical technique has many applications particularly in the
analysis of water, soil and stone samples. Due to simple exploitation, high
speed and accurate analysis makes it one of the most popular methods for the
determination of trace metals. Sensitivity of the method is about 0.05-0.1
ppm.
Fields of application: ecology, materials engineering, and medicine. |
|
X-ray
Fluorescence Spectrometer VRA-20
Wavelength-dispersive x-ray secondary-emission, or x-ray fluorescence
spectrometry (XRFS), is a nondestructive instrumental method of qualitative
and quantitative analysis for chemical elements based on measurement of the
wavelengths and intensities of their x-ray spectral lines emitted by
secondary excitation. The primary beam from an x-ray tube irradiates the
specimen (sample or standard), exciting each chemical element to emit
secondary spectral lines having wavelengths characteristic of that element
(basis of qualitative analysis) and intensities related to its concentration
(basis of quantitative analysis). The spectral lines are dispersed specially
by crystal diffraction prior to detection. X-RAY Fluorescence Spectrometer
enables to control elemental composition in different samples ranging from
few ppm (parts per million) to few weight percent for most types of matrices
for elements from Na to U. Complete range of related services including
sample preparation and data formatting according to the client needs are
proposed.
Typical application areas are: ecology, geology and mineralogy,
metallurgy, mining and chemical industry, precious metals industry, mining,
traffic and transportation, energy supply, machinery, agriculture, nutrition
industry, forensic medicine, museums |
Optical Emission Spectrometer Steel scope SL3
Atomic emission spectroscopy (AES or OES [optical emission spectroscopy])
employs quantitative analysis of the optical emission from the excited atoms
to determine analytic concentration. This device is used for solid metals
and alloys for the semi-quantitative analysis. Optical spectral range
available for the analysis is from 200 to 800 nm. Typical applications
include metals-alloys marking. |
Ultraviolet
and Visible Absorption Spectrometer SPECORD UV/VIS
UV-VIS spectroscopy is the measurement method based on the analysis of
absorption spectra in ultraviolet and visible light region. Ultraviolet and
visible light is energetic enough to excite outer electrons to higher energy
levels. UV-VIS spectroscopy is usually applied to identity molecules and
inorganic ions or complexes in solution. The UV-VIS spectra have broad bands
that are of limited use for sample identification but are very useful for
the quantitative measurements. Measuring the transmittance at some
wavelength and applying the Ber-Lambert law can determine the concentration
of the solvent in the solution. |
|
Fiber optic UV/VIS/NIR Spectrometer AvaSpec-2048
Spectrometer is based on the AvaBench-75 symmetrical Czerny-Turner
design with 2048 pixel CCD detector array. It is a device for measuring
light intensity in the UV, VIS and NIR regions. The AvaSpec-2048 is
especially suitable for low light level and high-resolution applications. It
is possible to use the spectrometer in the 172-1100 nm range. Resolution –
1.4 nm. |
 |
|
Infrared Spectrometer SPECORD 75 IR
Infrared (IR) spectroscopy is a powerful analytical tool for
characterization and identification of vibration spectra of molecules and
compounds. For example the IR spectrum of an organic compound serves as its
fingerprint and provides specific information about chemical bonding and
molecular structure. Using attenuated total reflectance (ATR), thin films
can be analyzed directly on a substrate. We use the IR in precise
determination of the chemical identity of organic contamination in a variety
of samples including samples from the disk drive, biomedical, semiconductor,
electronic, laser and optic industries. Analysis of polymers and plastics,
liquids, solids, and gases and identification on the molecular level are
available. |
|
X-ray
Photoelectron Spectrometer XSAM800 Kratos Analytical
The X-ray photoelectron spectrometer (XPS or ESCA) is versatile tool capable
of providing qualitative and quantitative analysis of any vacuum compatible
surface structure. It is based upon energy analysis of the spectra of
electrons emitted from the surface irradiated by x-ray beam. Almost all
chemical elements can be detected directly except hydrogen. However it is
possible undirected detection of the hydrogen. Chemical bonding information
can be determined from the chemical shift of atomic transitions. Information
can be obtained from up to the 10 nm depth. Angle between the X-ray beam and
sample can be changed in 30o-90o range. It enables nondestructive profiling
of the surface. Deeper profiling can be performed using ion beam etching.
Dual X-ray anode (Al/Mg) is used. X-ray energy - Mg Kα=1253.6 eV (line width
at half height 0.7 eV), Al Kα=1486.6 eV (line width at half height 1 eV).
Typical application areas are: analysis of surface structure of
vacuum-compatible inorganic and organic materials: metals, semiconductors,
dielectrics, polymeric films, etc. |
|
Thermal
Analysor
Paulic, Paulic Erdey Mod.1500
Thermal Analysis (TA) includes a group of methods by which the physical
and chemical properties of a substance, a mixture and/or reaction mixtures
are determined as a function of temperature or time, while the sample is
subjected to a controlled temperature program. The program may involve
heating or cooling (dynamic), or holding the temperature constant
(isothermal), or any combination of these. Thermal Analysator Paulic, Paulic
Erdey Mod.1500 is designed for high temperature applications, allowing
measurements to be carried out between 20°C and 1450°C. It can be equipped
with different furnaces, thus facilitating the broad temperature range.
Characteristics of the instrument are the extremely stable and reproducible
TG and DTA baselines. The high degree of sensitivity of the DTA sensor is
guaranteed even at temperatures above 1400°C. The electro magnetically
compensated, top-loading microbalance stands out due to high accuracy and
resolution in the µg range, as well as its excellent stability. Samples
weighing up to 5 g can be tested. These features are the basis for the
unique performance of this instrument. The high precision and excellent
reproducibility make the Mod.1500 an imperative tool for research,
development and quality assurance. Various thermal analytical techniques are
provided by Laboratory and these include differential thermal analysis
(DTA), thermogravimetry (TG) and differential thermogravimetry (DTG). These
techniques are mainly used as tools for the identification of minerals and
clay minerals in weathered rock, soils and clays and are complementary to
the X-ray analytical techniques.
DTA: It is techniques by which the difference in heat flow to or from a
sample and to or from a reference is monitored as a function of temperature
or time, while the sample is subjected to a controlled temperature program.
Specific heat, melting temperatures, transition enthalpies, phase
transformations, phase diagrams, crystallization temperatures, degree of
crystallinity, glass transition temperatures, decomposition effects,
reaction kinetics, purity can be investigated using this method.
TG: This is a technique by which the mass of the sample is monitored as a
function of temperature or time, while the sample is subjected to a
controlled temperature program.
Mass changes, decomposition temperatures, dehydroxilation,
corrosion/oxidation, thermal stability, reduction studies, composition,
reaction kinetics, purity can be investigated using this method. |
|
Gas
Chromatograph Chrome 5
Gas chromatography is a chromatographic technique that can be used to
separate gas and volatile organic compounds. The gas chromatograph consists
of an injection port, a separation column containing the stationary phase,
and detector. The organic compounds are separated due to differences in
their partitioning behavior between the mobile gas phase and the stationary
phase in the column.
|
|
High Pressure Liquid Chromatograph MiliXrom02
High Performance Liquid Chromatography (HPLC) is a tool for quantifying
and analyzing mixtures of chemical compounds. It's used to find the amount
of chemical compound within a mixture of other chemicals. The sample
dissolving in a solvent (like water or alcohol), thus the term LIQUID
chromatography. A detector measures response changes between the solvent
itself, and the solvent & sample when passing through it. The electrical
response is digitized and sent to a data system. |
X-ray
Diffractometer DRON 3.0
X-ray powder diffraction
runs are acquired on a Dron-3 X-ray Powder Diffractometer using Cu Ka
radiation on a theta-2theta goniometer equipped with a germanium solid-state
detector. Acquisition conditions are 35 kV and 30 mA. Scans are obtained
typically from 10 to 70 degrees 2theta, with step size or integration range
of 0.05 degrees 2theta, with a count time of 5 seconds. Raw diffraction
scans are stripped of Ka2
component, background corrected with a digital filter, and peaks are
identified using a variety of algorithms. Observed peak positions are
matched against the ICDD JCPDS database.
The sample preparation step is important for a successful powder diffraction
run. The sample should be ground to an approximately 100 µm powder; this is usually done
in a mortar under acetone or isopropanol, and the sample is most easily
loaded onto the 1 inch round glass disc while still a paste. A minimum of
100 milligrams is necessary for a good run, and although one can run with a
smaller amount of sample it will require much longer count times to get good
data.
Alternatively thin film on substrate can be used for the analysis.
Taking in account the employed holder geometry, typical dimensions of the
substrate should be: 2-5mm (thickness), (3-10)(width)x(15-25)(height) mm. |
|
Surface and Pore Size
Analysor Micromeritics M2100D
Single station analysis. Four probes simultaneously. Nitrogen adsorption and
desorption isotherms. BET and Langmuir surface area. BJH pore size
distribution analysis. Average pore volume, area, size and Total Pore Volume
(TPV). Micro-pore analysis. BET (Brunauer-Emmet-Teller) method is based on
adsorption of gaseous molecules on particles surface. The powder is
evacuating and heating to about 200ºC, after that nitrogen or xenon is
adsorbing in liquid nitrogen temperature. Surface of sample is calculating
by Brunauer-Emmet-Teller equation. Applications: powders of inorganic
materials, oxides, sorbents, catalysators |
|
Ion
Selective Electrodes (Potentiometer I-130M)
Potentiometry is electro analytical chemistry in which potential is
measured under the conditions of no current flow. The measured potential may
then be used to determine the analytical quantity of interest, generally the
concentration of some component of the analyzed solution. It has been used
to analyze metallic ions and anions in aqueous solutions. It is very simple
method. It may be used to analyze in situ. (about 15 elements).
Applications: analysis of the ocean water, river and stream water,
wastewater, sludge, suspensions. |
Scanning
Electron Microscope JEOL JSM-IC25S
Microscope is used for analysis of structure and morphology of conductive
and semiconductive surfaces. Analysis of the dielectric materials can be
performed using special surface preparation. Principle of scanning electron
microscopy is as follows: a focused electron beam is rastered over the
sample surface from which an image is formed from the secondary electrons.
Resolving power of a scanning electron microscope Joel JSM-IC25S reach up to
15 nm. Application areas of the microscope include: semiconductor device
technology, vacuum coatings and thin films, mineralogy, biology, chemistry,
etc. |
Laser Ellipsometer Gaertner L-115
Laser ellipsometer is used for the measurements of thickness and refractive
index of thin dielectric and semiconducting films. Laser elipsometry is
based on the analysis of parameters of polarization of monochromatic
polarized light beam reflected from the sample. Length of the light wave
used is 632.8 nm. Thickness of films possible for analysis is 0.001 - 1 µm.
Uncertainty of thickness measurements is ±(0.5 – 1) nm. Accuracy of the
refractive index measurements ±0.01. Application areas: measurements of
refractive index and thickness of the dielectric and semiconducting thin
films, semitransparent thin metal films (< 50 nm), polymeric thin films
(e.g. photo resist). |
|
Micro Interferometer MII – 4
Micro interferometer is used for the measurements of thickness and surface
roughness of thin opaque films. It is based on the phenomena of light
interference. Range of measurements – (0.03 - 1.0) µm. Accuracy - ±(15-30)
nm. Application areas of the interferometer include visual evaluation and
measurement of the height of surface roughness, measurement of the vertical
dimensions of microstructures. |
|
Optical
Analyzers Nikon S and Nikon N2
Optical analyzer Nikon (model S) is used for measuring of linear
dimensions of the transparent structures in automatic mode with high
fidelity (uncertainty of measurements do not exceeds (0.1+L/500) µm, where L
is length of the structure under measurement). Enlargement of the optical
analyzer x1200. Optical analyzer - comparator Nikon (model N2) with
enlargement of x800 is used for measuring of linear dimensions of the
structures using transmitted or reflected light mode. This analyzer -
comparator is especially useful when measuring a step error of planar
topology. Possible application areas include: photo mask control, step
error, semiconductor wafer control. |
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Image Analysis Techniques
The analysis of particles from both a qualitative and quantitative aspects
must include image analysis techniques. Image analysis is also a powerful
tool for the measurement and characterization of many biological and natural
materials. The imaging systems facility is closely related to the laboratory
and runs various packages for image analysis (e.g. Scion Image), graphics
processing and modeling (e.g. Photoshop, Surfer). Analytical facilities and
processing software can be tailored to individual project needs and to date
work has been done on satellite image processing, quantification of scanning
electron microscopy images, routine digital photography. |
|
Equipment for Measurements of Microwave Parameters
Measurements of the transmission and reflectivity of microwaves in the
frequency range 12 - 78 GHz are carried out in the waveguides using
panoramic meters of standing wave factor P2-65, P2-66, P2-67, P2-68 and
P2-69. |
|
Atomic Force Microscope NT-206
Atomic Force Microscope (AFM) is used for investigation of the surfaces of various materials.
It supports operations in the following modes:
Static (including contact mode (of topography) and lateral force microscopy),
Dynamic (including non-contact and intermittent/analogous to Tapping Mode®/ mode),
Static/ Dynamic force spectroscopy.
Characteristics of the AFM:
maximum scan field area: up to 30x30 microns; measurement
matrix up to 512x512 points and more;
maximum range of measured heights: 4 microns;
lateral resolution: 2 nm,
vertical resolution: 0.1 - 0.2 nm;
|
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Scratch Tester
The adherence and hardness of thin coatings can be measured with the PC
controlled scratch tester. During the scratch test the sample is scratched
with an indenter applying the increasing normal force (load). The
displacement of the indenter, normal force and the occurring tangential
(frictional) force are recorded in real time. Sharp increase of the
tangential force pinpoints the spot on a scratch track where the coating
destruction begins. Knowing that spot the critical normal force where
destruction of the coating takes place can be acquired from the scratch
diagram. |
 |
|
Afterwards the sample is
photographed under optical microscope to determine the type of
scratch-induced defects as well as the width of scratch track. When scanning
a scratched sample with AFM it is possible to determine the depth of the
scratch track. After relating normal force, and the width or the depth of
the scratch track, it is possible to determine the hardness of the coating.
Comparing the critical normal forces of coating destruction one can compare
the adherence of several samples. It is possible to evaluate the friction
coefficient between the known indenter and the surface of the coating as
well. There are 3 construction vertions for
measuring with the corresponding maximal loads and accuracies:
|
|
Normal force, N |
Tangential force, N |
|
I |
0,340±0,009 |
0,070±0,002 |
|
II |
3,50±0,07 |
0,180±0,005 |
|
III |
5,40±0,12 |
2,30±0,05 |
Minimal length of the scratch sample is 15mm. |
|
Surface Roughness Tester TR200
TR200 is a portable roughness instrument. This instrument applies to
production site and can be used to measure surface roughnesses of various
machinery-processed parts (compatible with standards ISO, DIN, ANSI, and JIS),
calculate corresponding parameters according to the selected measuring
conditions and clearly display all measurement parameters and profile graphs
on LCD or on monitor of computer. |
 |
Technical specifications
Roughness parameters Ra, Rz, Ry, Rq, Rt, Rp, Rmax, Rv, R3z, RS, RSm,
RSk,Rmr, Primary profile (P), compatible with standards ISO, DIN, ANSI, and
JIS.
Measurement range: 160 mm,
resolution up to 0.01 mm
Cutoff length 0.25mm / 0.8mm / 2.5mm
Pick-up Diamond tip radius 5μ, probe angle 90º
Data output RS232; direct to printer or PC
Digital filter RC, PC-RC, Gauss, D-P
Power Li-ion battery rechargeable
Charger 220V / 110V, 50Hz, 2.5 hours (charging time)
Working temperature 0 - 40 ºC
Dimensions 141mm×56mm×48mm
Weight 480 g |
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