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Mask alignment and exposure systems

 

Mask alignment and exposure system MA750 

The machine is used for mask alignment and exposure on one side. Automatic, manual and adjustment modes are possible. Loading/unloading is motorized by a stepping motor.
Exposure time: 0 s – 30 min
Maximal diameter of substrate: 143 mm
Inscribed area: 101.6 × 101.6 mm
Substrate thickness: 0 – 10 mm
Mask: 203.2 × 203.2 mm
Mask holder
            movement along XY: ± 3 mm
            rotation: ± 3 degrees
            sensitivity: 1/1000 degree
Chuck
            motorized XY motion: ± 0,3 mm
            rotation: ± 2.5 degrees
            sensitivity: 0,1/1000 degree

Mask alignment and exposure system KSM MJB 2

Mask alignment and exposure system for simultaneous primary and multiple exposure on both sides. It can work in step mode or automatic mode. The system is designed so that it can be used for a wide range of exposure techniques since different components of the machine can easily be adapted to specific requirements.

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